martes, 22 de junio de 2010

Techniques of GaN crystal Growth

   Techniques of GaN crystal
                    Growth

Courtesy of Fu Xiaoling. Used with permission.


Outline
Major properties of GaN
Significance of growing bulk GaN crystal
Methods we have achieved
Challenges we still have
GaN devices impact on the future

Properties of GaN
1.high melting point (2791K) at a
correspondingly high equilibrium
pressure of nitrogen(45Kbar)
2. wide, direct bandgap of 3.39ev
3.high thermal conductivity
4.high electron saturation velocity

Why GaN ?
Great potential applications in highpower
electronics capable of operation
at elevated temperatures and high
frequencies.

Difficulties we have met
Difficult to get native substrates in high
quality and large quantities
Even the slight lattice mismatch induce
misfit dislocations at the interface,which
could develop cracks in crystals that
degrade the performance of devices

Substrates we have used
Have tried sapphire(Al2O3), SiC, MgO,
MgAl2O4, LiAlO2,LIGaO2, ZnO, MoS2 et al.
Most common use: sapphire
Better quality in many cases
Available up to inches in diameter
Inexpensive

Main Methods we have got
Vapor phase epitaxy(HVPE)
Molecular beam epitaxy (MBE)
Metalorganic chemical vapor
deposition(MOCVD)

Crytal growth of GaN (HVPE)
Long history and widely used because of high growth
rate
Hydride vapour phase epitaxy(HVPE) attract renewed
interest to produce thick, strain-relieved buffer layers.

Comments on VPE
Highly suitable for GaN films due to high growth rate
and bandgap engineering in near-UV spectral range
is possible
However, the very high growth temperature of VPE
processes, between 1000 and 1200 degrees make Si
and O impurity concentration high, which makes
electron concentration high
Growth rate:100um/h have been achieved.

Crystal growth of GaN(MBE)
1. Nitrogen gas cannot be
directly used for GaN growth.
Nitrogen (N2) must be
dissociated prior to reaching the
surface of the substrate in order
to incorporate in GaN.
2. Low temperature

Comments on MBE
Advantages:
High purity growth
Hydrogen free environment
Possibility to use plasma or Laser assisted growth
Disadvantages:
Need ultra-high vacuum
Low growth rate
Very expensive

Crystal growth of GaN(MOCVD)
Basic MOCVD reaction describing GaN deposition process:
Ga(CH3)3+NH3??GaN
For high optical quality material it's necessary to grow GaN at
temperatures as high as 1080 degrees.
The deposition of a low temperature "buffer"layer of AlN on
sapphire substrates was a key discovery in improving surface
morphology and crystalline quality of GaN.

Comment on MOCVD
Advantages:
High growth rate
Large-area growth capability
Very high quality film
Intermediate cost
Disadvantages:
High temperature
Tendency to preact

Various new technologies
Modified VPE process: Sublimation sandwich
method(SSM):
good structural quality for films grown at very high rates
Lateral epitaxial overgrowth(LEO) by MOCVD:
Reduce defect density tremendously, but only in the windows, not on
the mask
enable the controlled deposition of low-dimensional microstructures
such as quantum wires and dots, don't cause any damage or
contamination at sample surface.

Challenges
Need maturer technology:
Larger size
Defect free (Has been reduced from 108–1010 cm-2 to
107 cm-2 not low enough)
Low cost
Doping issues.

Impact on the future
Enable the fabrication of LEDS, lasers,
detectors, transistors and so on
Save lots of energy
Harmless

Major References
Fabrication and performance of GaN electronic devices, Materials
Science and Engineering: R: Reports, Volume 30, Issues 3-6, 1
December 2000, Pages 55-212
S. J. Pearton, F. Ren, A. P. Zhang and K. P. Lee
Progress and prospects of group-III nitride semiconductors, Progress in
Quantum Electronics, Volume 20, Issues 5-6, 1996, Pages 361-525
S. N. Mohammad and H. Morkoç
GaN heteroepitaxial growth techniques, Journal of Microwaves and
Optoelectronics, Vol.2, No.3,July 2001, P22-29
Nasser N.M, Ye Zhi zhen, Li Jiawei and Xu Ya bou
Growth and applications of Group III-nitrides, Journal of applied
Physics, 31(1998) 2653-2710
O Ambacher.

Nitride semiconductors––impact on the future world, Journal of
Crystal Growth, Volumes 237-239, Part 2, April 2002, Pages 905-911
Isamu Akasaki.


Bárbara Scarlett Betancourt Morales
CAF


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